Modular Rotary Sample Heater
Reliable and Uniform Heating with Rotation
This versatile rotary sample wafer heater is a UHV-compatible stage for precise radiant heating of semiconductor wafers during thin-film deposition, annealing, and other high-temperature processes in ultra-high vacuum environments. Available in standard sizes for 2", 4", and 6" wafers, it mounts easily on a 4½” (CF63) or larger flange, integrating seamlessly into most existing UHV chambers. It is designed for reliability and ease of maintenance, with integrated water cooling, continuous azimuthal rotation, all necessary electrical and mechanical feedthroughs, and Type K thermocouple for accurate temperature monitoring.
PBN Heater Element
Heating is achieved via a robust pyrolytic boron nitride (PBN), providing excellent thermal uniformity and stability up to 800°C (higher temperatures available on request). The large radiating surface ensures efficient heat transfer to the wafer while operating at lower element temperatures for extended lifetime. Power requirements are typically 0-30 Volts at 0-50 Amps, depending on size and target temperature, with optional wafer clips or retainers for secure sample mounting. Continuous rotation (standard 20 rpm) via magnetically coupled drive maximizes temperature and deposition uniformity without interrupting the process. The in-vac drive assembly is water cooled to protect the drive system from thermal soak saturation.
The wafer plate can be easily accessed for loading/unloading without dismantling the stage. All materials are selected for clean UHV performance, minimizing outgassing and contamination.
Temperature Monitoring and Control
A Type K (Chromel-Alumel) thermocouple is integrated directly at the heater element (Type C optional for higher temperature applications), providing reliable feedback for precise control over the standard range up to 800°C. An optional secondary thermocouple near the wafer surface allows calibration and repeatable returns to known temperature profiles. Thermocouple feedthrough is integrated in the conflat flange with standard TC socket for ease of instrumentation connection.
Compact and Customizable Design
The entire assembly is compact, with water cooling connections, power leads, thermocouple, and rotary drive conveniently grouped on the mounting flange. The low-profile design clears standard chamber ports, with a heater diameter less than 1.5" larger than the sample. The standard flange-to-wafer distance is 8" but custom dimensions can be specified at no extra cost in most cases. Since custom configurations often cost no more than standards at our facility, options such as biasing, Z-shift, or enhanced cooling are readily available.